Wafer-scale photodetector (thin slice-based) device fabricated 

  • IASbaba
  • May 11, 2020
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Wafer-scale photodetector (thin slice-based) device fabricated 

Part of: GS Prelims and GS-III – Science and Technology

In News:

  • Recently, scientists from the Jawaharlal Nehru Centre for Advanced Scientific Research (JNCASR) have fabricated a wafer-scale photodetector (thin slice-based) device, using gold-silicon interface.
  • JNCASR is an autonomous institute under the Department of Science and Technology (DST).

Key takeaways:

  • The gold (Au)-silicon (n-Si) interface shows high sensitivity towards light. 
  • The Au-Si interface was brought about by galvanic deposition (a technique for electroplating of metals) wherein water-based solutions (electrolytes) are used, which contain the metals to be deposited as ions.

Important value additions:


  • These are an important part of an opto-electronic circuit that can detect light.
  • Their applications include:
    • Controlling automatic lighting in supermarkets.
    • Being used in security-related applications.
  • Photodetectors are unaffordable for daily applications due to high material costs.
  • Au-Si interface Photodetectors has many advantages:
    • The fabricating process is quick and simple. 
    • The method is highly economical since it is a solution-based technique. 
    • It can detect weak scattered light as an indication of unwanted activity.
    • The device does not require external power to operate and runs on self-operated mode. 

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